SEOUL, South Korea / RankWire.AI / – Samsung Electronics introduced its next-generation approach to memory and storage systems designed for artificial intelligence infrastructure during the 2026 OCP Global Summit. The company shared its plans at the event in San Jose, California, held from October 12 to 15. The presentation covered three technological pathways: high-performance memory, Compute Express Link-based memory expansion, and cutting-edge solid-state drives. Additionally, Samsung announced a collaborative CXL demonstration with Advanced Micro Devices. The overarching goal of the strategy is to address memory bottlenecks that hinder larger AI workloads.
Samsung’s methodology centers on enhancing speed, expanding memory scalability, and ensuring data persistence. The first pillar emphasizes high-performance memory, with Samsung showcasing customized high-bandwidth memory and HBM5, its eighth-generation HBM. The second pillar leverages CXL technology to increase memory capacity beyond what standard server configurations typically support. The third focuses on data storage and management through next-generation enterprise SSDs and advanced storage software. Samsung states that these three components work synergistically to boost overall AI system performance.
The company connected its strategic vision to the increasing demand for memory driven by AI agents and inference tasks. As models grow larger, they generate more data during inference and require additional memory capacity to store it. Typical server configurations often limit the available memory per processor. Samsung proposed CXL as a solution to surpass these restrictions without necessitating a complete system redesign. The company also emphasized key-value cache optimization, which enables AI models to reuse previously processed data instead of recalculating it repeatedly.
Samsung and AMD Collaborate on CXL Memory Expansion Demo
At the summit, Samsung and AMD jointly demonstrated a CXL-based memory expansion solution. This technology allows processors to share memory resources and dynamically scale capacity across AI systems. Samsung reports that the solution has been validated in actual system environments. The two firms signed a memorandum of understanding in March 2026 to explore next-generation AI memory and computing innovations. Moreover, AMD Chief Executive Lisa Su visited South Korea on October 7 to discuss further cooperation in memory and foundry sectors.
Samsung also showcased CMM-D, its CXL-compatible DRAM memory module, configured in a memory pooling setup. This arrangement connects multiple CXL memory units into a shared pool, from which different systems can draw as needed. Additional exhibits included processing-in-memory technology, which performs calculations inside memory chips to reduce data transfer. Samsung displayed 2-nanometer gate-all-around wafers and Groq LPU wafers. Nvidia’s Groq 3 LPX system was also among the products featured in the company’s displays.
Early Access to Memory Validation for Strategic Partners
During an executive session, Shim Ho-jun, Corporate Vice President and Head of Samsung’s Application Engineering Team, presented the company’s strategic approach. He highlighted that expanding memory capacity and bandwidth is becoming increasingly vital as AI models expand and inference workloads intensify. Shim explained that Samsung is intensifying co-design and technical validation efforts with global partners early in development stages. This approach aims to align memory product development with customer system requirements ahead of commercialization.
Samsung’s MAX Lab facilitates this process by allowing clients to test memory and storage solutions under real AI workloads. It enables validation of technologies such as processing-in-memory (PIM) and next-generation SSDs before they reach the market. As a Diamond Sponsor, Samsung participated in the Open Compute Project event at the summit. This involvement follows the company’s presentations at Nvidia GTC in March, COMPUTEX in June, and the Future of Memory and Storage conference in August. Samsung continues to emphasize that increasing memory capacity remains central to enhancing AI infrastructure performance.